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| ZMD-Standard March 2000 Package SSOP16 (3,9 mm) Dimensions in millimetres Based on JEDEC JEP95: MO-137 1 Dimensions MDS 756 Supersedes Edition 02.99 b 0,15M A2 0,1 16 A1 c LP G 1,54 0,10 0,25 1,40 1,55 0,18 0,25 4,80 4,98 3,82 4,00 0,25 0 10 * without mold-flash Z 1 e D Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,4 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 1,73 0,20 0,30 0,635 5,84 6,20 0,41 0,27 HE E A X View X k x 45 Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* kmin qmin qmax Zentrum Mikroelektronik Dresden Editor: Check: Date: Quality: Doc-No. QS-000756-HD-02 |
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